Semtech’s 200G/lane modulator driver and TIA ICs accelerate the industry’s transition to XPO for AI network infrastructure
Semtech Corporation , a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), an industry initiative to enable high-bandwidth optical interconnects for AI network infrastructure. As a technology partner to the MSA, Semtech brings a broad portfolio of 200G/lane modulator driver and transimpedance amplifier (TIA) integrated circuits designed to support XPO transceiver development and volume deployment.
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AI infrastructure buildouts continue to demand higher network throughput and bandwidth density at lower power, driving the industry toward new transceiver form factors capable of meeting these requirements at scale. XPO addresses these demands in a groundbreaking new pluggable optical transceiver form factor with industry-leading faceplate density.
“AI requires datacom optics with the highest performance, speed and density, and the market is poised to rapidly shift to 200G/lane electrical solutions this year,” said Scott Wilkinson, lead analyst for optical components at Cignal AI. “As AI operators transition to these high-speed optics, demand will continue to rapidly expand from $9 billion at the start of the AI revolution in 2024 to an estimated $37 billion in 2026.”
“XPO represents an innovative and practical approach to addressing network density challenges while preserving the field-serviceability and configurability benefits of pluggable optics,” said Scott Schube, vice president of applications engineering and product definition at Semtech. “Semtech’s portfolio of high-performance modulator drivers and TIAs is designed to support the XPO ecosystem from early prototyping through volume deployment.”
Semtech’s 200G/lane Optical IC Portfolio for XPO
Semtech provides a broad portfolio of high-performance linear modulator driver and TIA ICs with low power, ultra-low latency and high density designed to support XPO transceiver applications.
Semtech’s XPO product family includes:
- GN1834L and GN1834DL quad TIAs with 750mm channel pitch
- GN1838L and GN1838DL octal TIAs with 500mm channel pitch
- GN42T380 octal TIA with 375mm channel pitch
- TN1877 quad and TN1887 octal Mach-Zehnder Modulator (MZM) drivers with 625mm channel pitch
- GN42M380 octal MZM driver with 375mm channel pitch
Key capabilities of the family include:
- Multiple configurations for maximum module and PIC design flexibility
- High linearity for best link integrity
- On-chip equalization to seamlessly optimize performance over different electrical PCB and optical channels, and enable use of different optics
- Integrated telemetry features for rapid time-to-market and link analysis and tuning
- Ultra-low latency optimized for high-density AI network switch and fabric applications
- High integration enabling compact transceiver designs consistent with XPO form factor requirements
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