Efinix Selects Winbond HyperRAM for its Ti60 F100 Platform to Drive a New Generation of Compact, Ultra-Low Power AI and IoT Devices
– Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix Titanium Ti60 F100 FPGA with the performance, low power consumption and small size...
