BizLink Announces the World’s First VESA Certified DP80 Enhanced mDP Cable
BizLink, a global leader in interconnect solutions, is proud to announce the release of its DP80 Enhanced mDP cable in the market, which is the...
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Ranovus Demonstrates Industry’s First Adaptive Compute Acceleration Co-Packaged Optics Platform with Xilinx Versal and Ranovus Odin™ 800Gbps CPO 2.0
Ranovus’ Odin™ Analog-Drive CPO 2.0 eliminates the need for the retimer, resulting in 75% smaller footprint and 40% cost and power consumption savings in the...
Marvell Introduces Industry’s First 800G Multimode Electro-Optics Platform for Cloud Data Centers
AI, ML and HPC Applications Drive Cloud-Optimized 800G PAM4 Interconnects Marvell announced the industry’s first 800Gbps or 8 x 100Gbps multimode platform solution, that enables data...
Huawei Unveils Full-Stack Data Center Solution to Renew Digital Infrastructure
At MWC 2022 Barcelona, Huawei unveiled the Full-Stack Data Center Solution during the Huawei Full-Stack Data Center Forum. Designed to help enterprises embrace modern data...
Marvell Expands Interconnect Portfolio with Industry’s 1st Cloud-Optimized 400G/800G PAM4 DSPs for Active Electrical Cables
Enters New Category of Data Center Interconnects to Address Growing AI Accelerator and Networking Bandwidth Requirements Marvell introduced its Alaska A PAM4 DSP family for Active Electrical Cables...
OmniSci Announces Rebrand to HEAVY.AI to Mark a New Era of Advanced Analytics for Time-sensitive Decision-making at Enterprise Scale
Rebrand Follows Corporate Achievements in 2021, Including Market Growth in Key Industries, Product Advancements, Strategic Partnerships and Key Executive Hires OmniSci, an innovator in advanced...
Fibocom Launches Advanced 5G Modules FG160 and SC171, Powering Up Intelligent Connectivity for 5G AIoT – MWC Barcelona 2022
During MWC Barcelona 2022, Fibocom launches the 3GPP R16-compliant module FG160 and 5G smart module SC171, powering up the intelligent connectivity for 5G AIoT. Meanwhile,...
Telit Introduces Next Gen 3GPP Release 16 5G M.2 Modules Powered by Snapdragon® X65 and X62 Modem-RF Systems
– New 3GPP Release 16 compliant modules are the latest in Telit’s long tradition of being an early adopter of Qualcomm Technologies’ innovations – Next...
5G+XR: Bringing Imagination into Reality
During the 5G: Connecting Virtual and Reality session at MWC22 Barcelona, Huawei Carrier BG’s Chief Marketing Officer Philip Song delivered the keynote speech: “5G+XR: Bringing Imagination into Reality”....
Marvell and Molex Unveil 400G OpenZR+ Pluggable Optical Module for Carrier and Cloud Data Center Networks
Enables Disruptive Infrastructure Architectures for 5G and Cloud Services Marvell and Molex today announced a collaboration to deliver a 400G QSFP-DD optical module that supports the...