Joint Development Agreement builds on ongoing collaboration with Manz Asia
Smartkem, which is seeking to change the world of electronics with a new class of transistor technology, announced that it has entered into a preliminary Joint Development Agreement (JDA) with Manz Asia, a pioneer in advanced packaging equipment for the semiconductor industry, which, when finalized will focus on the co-development of next generation dielectric ink solutions for advanced packaging manufacturing, particularly tailored for AI chip packaging applications.
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Smartkem Chairman and CEO, Ian Jenks, comments: “This joint development agreement builds on our collaboration with Manz Asia which has already resulted in our first demonstration at SEMICON® SEA 2025 of an advanced inkjet metalization process for packaging chips for production. Together, we intend to develop scalable, high-performance solutions that address the critical bottlenecks particularly in advanced computer and AI chip packaging. By combining Smartkem’s unique semiconductor materials with Manz’s precision inkjet technology, we expect to create new manufacturing paradigms that address the demand for 12″ wafer-level packaging solutions as well as extend beyond wafer-based limitations to open the door to efficient, large-area panel packaging. If successful our efforts will result in higher yield and lower cost per packaged chip, which we believe is critical for data centers deploying tens of thousands of AI accelerators.”
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Manz Asia General Manager, Robert Lin, comments, “By combining Smartkem’s expertise in material science with Manz Asia’s engineering excellence in semiconductor manufacturing equipment, we believe that this JDA will fast-track the industrial adoption of dielectric ink technology, delivering new levels of scalability, resolution, and reliability for future chip integration. Dielectric inks play a critical role in back-end-of-line (BEOL) processes, particularly in top metal layer insulation and redistribution layer (RDL) patterning for advanced packaging. Smartkem’s innovative dielectric formulations offer high-resolution patterning, robust film integrity, and excellent chemical compatibility – essential for supporting complex interconnect architectures.”
As demand for AI computing accelerates, advances in 12″ wafer-level packaging and large-area panel packaging could offer a transformative path forward for data center infrastructure. By moving beyond the limitations of traditional wafer-based approaches, panel-level packaging enables higher chip density, faster interconnects, improved thermal management, and more sustainable manufacturing processes. Smartkem and Manz believe that these benefits are essential to scaling the next generation of AI hardware, delivering greater performance and efficiency while reducing cost and environmental impact.
The JDA is preliminary only, is not-binding on the parties and there can be no assurance as to whether or when a definitive development agreement will be executed by the parties or as to the ultimate terms or outcome of any such project.
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