CIO Influence
CIO Influence News Machine Learning

Cadence and Autodesk Collaborate on Smart Product Design

Cadence and Autodesk Collaborate on Smart Product Design
  • Partnership provides automated design synchronization between Autodesk Fusion and Cadence’s generative AI-powered Allegro X and OrCAD X platforms

  • Leverages Cadence’s new X AI capability that significantly improves PCB design productivity

  • Solutions include Cadence’s industry-leading multiphysics analysis

Cadence Design Systems announced a collaboration with Autodesk to provide solutions that accelerate intelligent system design leveraging Autodesk Fusion and Cadence PCB solutions. This new integration offers customers seamless collaboration between electronic and mechanical engineering to accelerate the development of smart products through efficient co-design.

PREDICTIONS SERIES 2024 - CIO InfluenceCIO INFLUENCE News: Webscale Acquires to Launch CloudFlow

“Our partnership with Cadence powers a seamless collaboration between mechanical and electronics design, putting customers at the center”

Electrical and mechanical engineers face increased pressure to produce products with fewer revisions, making efficient collaboration key to delivering smart products to market on time. Current manual design data methods require users to exchange files that can differ from design intent, resulting in errors, unnecessary re-work and costly delays.

To address these challenges, the companies have integrated Autodesk Fusion with Cadence’s Allegro X and OrCAD X platforms into a solution that enables seamless bi-directional communication between PCB designers and mechanical engineers. The platform integration enables companies to take full advantage of cloud-based mechanical design and generative AI/ML PCB design, while fully leveraging multiphysics analysis for power, thermal, electromagnetics and more.

“The electronics industry is being disrupted on multiple fronts including supply chain challenges and rapidly accelerating product complexity,” said Tom Beckley, senior vice president, Cadence. “Our partnership with Autodesk provides access to leading-edge technology for electronic design integrated with Autodesk’s leading cloud-enabled, connected mechanical CAD solutions.”

CIO INFLUENCE News: D-Wave Showcases Advantage QPU’s Ability to Improve Cellphone Network Transmission

“Our partnership with Cadence powers a seamless collaboration between mechanical and electronics design, putting customers at the center,” said Jeff Kinder, executive vice president, Autodesk. “Manufacturers need to bring more complex products to the market faster – all while juggling distributed teams, supply chain disruptions, and costs. This integration further extends Autodesk’s vision to connect end-to-end design and make processes in manufacturing.”

[To share your insights with us, please write to]

Related posts

infodas Receives NITES Certification from the Cyber Security Agency of Singapore

CD2 Learning and CampusGuard Partner to Empower Corporate Cybersecurity Training

PR Newswire

Youredi Becomes A Key Integration Partner For The CargoX Platform

CIO Influence News Desk