CIO Influence
CIO Influence News Machine Learning

Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology

Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology

Ansys electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications

  • Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel’s embedded multi-die interconnect bridge (EMIB) assembly technology

  • Ansys multiphysics analyses provide signoff verification of thermal integrity, power integrity, and mechanical reliability

Ansys and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel’s innovative 2.5D chip assembly technology, which uses EMIB technology to connect the die flexibly and without the need for through-silicon vias (TSVs). Ansys’ accurate simulation engines deliver higher speeds, lower power consumption, and greater reliability in advanced silicon systems for artificial intelligence (AI), high-performance computing, autonomous driving, and graphic processing.

Recommended: Top 10 CIO Influence News of Jan’24

Ansys RedHawk-SC Electrothermal is an electronic design automation (EDA) platform that enables multiphysics analysis of 2.5D and 3D-ICs with multiple dies. It can perform thermal analysis with anisotropic thermal conduction, which is essential for Intel’s new backside power distribution technology. Thermal gradients also lead to mechanical stresses and warpage that can impact product reliability over time. Power integrity verification is done through chip/package co-simulation, which gives the 3D system-level context needed for maximum accuracy.

“Intel’s enablement of Intel 18A and EMIB technology is a differentiated approach to multi-die assembly that has a number of significant advantages over traditional stacking techniques,” said Rahul Goyal, vice president & general manager, product and design ecosystem enablement at Intel. “We will collaborate closely with Ansys to make the full benefit of this innovation easily accessible to our joint customers so they can create more competitive products.”

Read more: Trellix and One Source Deliver Industry-Leading Managed Detection and Response Security Services

“Ansys has collaborated with Intel Foundry at the leading edge of 3D manufacturing technology to solve complex multiphysics challenges and meet stringent thermal, mechanical, performance, and reliability requirements,” said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Ansys’ multiphysics signoff platform gives our mutual customers the flexibility to adopt EMIB technology for their system architecture and assemble the best-of-breed solutions for higher performance products and a smooth user experience.”

Read more: Google Cloud and Hugging Face Announce Strategic Partnership to Accelerate Generative AI and ML Development

[To share your insights with us as part of editorial or sponsored content, please write to sghosh@martechseries.com]

Related posts

Vercel’s Frontend Cloud: Introducing Embedded Storage, Security and Workflow Solutions

Business Wire

Nobl9 Introduces Reliability Center – The Single Source of Truth for Enterprise Software Reliability

Business Wire

TruWeather Solutions Forges Partnership with Iris Automation for UAS Weather-enhanced Ground-based Surveillance