Companies to combine leadership in probe, interface, and test technologies to accelerate AI and high-performance compute deployments
FormFactor, Inc., a leading provider of semiconductor test and measurement technologies, and Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced the two companies have entered into a broad technology collaboration aimed at accelerating the development, validation, and high-volume production deployment of next-generation semiconductor devices. In addition, Teradyne has agreed to purchase shares of FormFactor common stock.
The collaboration brings together FormFactor’s industry-leading expertise in probe technologies, interface solutions, test engineering, and device characterization with Teradyne’s advanced automated test platforms to help customers address growing semiconductor complexity. Together, the companies will partner to advance semiconductor test architectures, optimize test infrastructure, and enhance production readiness for existing and emerging applications, including high-performance compute (HPC), advanced packaging, high-bandwidth memory (HBM), and silicon photonics.
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“The semiconductor industry is entering a period where test performance, scalability, and time-to-market are becoming decisive competitive advantages,” said Mike Slessor, Chief Executive Officer of FormFactor. “By combining FormFactor’s deep expertise in device characterization, probing, interfaces, and production test solutions with Teradyne’s test platforms, we can help customers accelerate innovation and move more efficiently from technology development to high-volume manufacturing.”
“The most demanding test challenges in advanced packaging, silicon photonics, and memory can’t be solved by a single company,” said Gregory Smith, President and Chief Executive Officer of Teradyne. “By investing in FormFactor and combining our leading-edge test platforms with FormFactor’s probe and interface expertise, we’re building a more complete, validated path to production for our shared customers, and reinforcing our commitment to an open, interoperable ecosystem.”
The companies believe the collaboration will accelerate innovation across the semiconductor test ecosystem from wafer to data center, expand opportunities for joint customer engagement, and support increasing demand for advanced computing, AI infrastructure, and next-generation semiconductor technologies.
Under the terms of the agreement, Teradyne has agreed to make a $300 million strategic equity investment. The transaction is subject to customary closing conditions and regulatory approvals.
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