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Multiyear agreement to enable best-in-class system-on-chips (SoCs) for the AI, high performance computing (HPC) and mobile markets.
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Joint development on customized intellectual property (IP), design flows and design techniques for Intel’s most advanced RibbonFET processes on Intel 18A and beyond.
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Further strengthening of strong existing partnership to advance Intel’s IDM 2.0 strategy, creating a more robust offering for new and existing Intel Foundry Services (IFS) customers.
Intel Foundry Services (IFS) and Cadence Design Systems, announced they have expanded their partnership and entered into a multiyear strategic agreement to jointly develop a portfolio of key customized IP, optimized design flows and techniques for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery. Joint customers will be able to accelerate their SoC project schedules on process nodes from Intel 18A and beyond while optimizing for performance, power, area, bandwidth and latency for demanding AI, HPC and premium mobile applications.
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“We’re very excited to expand our partnership with Cadence to grow the IP ecosystem for IFS and provide choice for customers”
“We furthered our partnership with Intel Foundry Services through a significant strategic multiyear agreement to provide design software and leading IP at multiple Intel advanced nodes, thereby advancing Intel’s IDM 2.0 strategy and accelerating mutual customer success,” said Anirudh Devgan, president and chief executive officer at Cadence.
“We’re very excited to expand our partnership with Cadence to grow the IP ecosystem for IFS and provide choice for customers,” said Stuart Pann, Intel senior vice president and general manager of IFS. “We will leverage Cadence’s world-class portfolio of leading IP and advanced design solutions to enable our customers to deliver high-volume, high-performance and power-efficient SoCs on Intel’s leading-edge process technologies.”
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Fast-growing market segments, such as AI/ML, HPC and premium mobile computing, require the latest standards in IP to take advantage of advanced packaging and silicon process technologies. Cadence’s leading-edge implementations of trailblazing standards, such as advanced memory protocols, PCI Express, UCI Express and others for these key segments, enable joint customers to achieve scalable, high-performance designs that accelerate their time to market in IFS’ most advanced silicon technologies and 3D-IC packaging capabilities.
Building a world-class foundry business is key to Intel’s IDM 2.0 strategy, and this agreement strengthens IFS’ offerings by making an additional portfolio of essential design tools, flows and interface IP available for foundry customers. It builds on Intel’s engagement with other industry-leading IP providers as it continues to grow the IP ecosystem for IFS customers.
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