Hyperlume, Inc. (“Hyperlume” or the “Company”) has completed a $12,500,000 USD seed round to commercialize its high bandwidth, low latency, low power interconnects for AI data centers and high-performance computing systems. The oversubscribed round, led by BDC’s Deep Tech Venture Fund and ArcTern Ventures with participation from MUUS Climate Partners, SOSV and Intel Capital also includes a strategic investment from LG Technology Ventures.
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Hyperlume was founded in 2022 by Mohsen Asad and Hossein Fariborzi to develop breakthrough technology that addresses connectivity bottlenecks in accelerated computing and AI data centers. Hyperlume’s unique technology uses specialized, ultra-fast microLEDs and ultra-low power circuitry to achieve significant performance, cost and energy-efficiency gains relative to the traditional copper interconnects.
“This funding represents a significant step in Hyperlume’s journey as we continue to push the boundaries of optical communication and deliver transformative solutions for the AI and semiconductor industries,” said Mohsen Asad, Co-founder and CEO of Hyperlume. “We are grateful for the trust and support of our investors who share our vision of a more efficient and sustainable future for computing.”
A New Paradigm in Computing
As AI models exceed 1 trillion parameters and high-performance computing clusters surpass 100,000 GPUs, today’s interconnect technology is becoming a critical bottleneck to computing performance. The future of computing requires a new level of connectivity—higher bandwidth, lower latency, and step-change improvements in energy efficiency.
Hyperlume’s novel technology is designed to overcome the energy and bandwidth bottlenecks inherent in traditional electronic interconnects, offering pluggable, mid-board and co-packaged optical alternatives.
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With this funding, the company plans to:
- Accelerate development of optical interconnect technologies
- Expand its product, engineering and R&D teams
- Strengthen strategic partnerships with leading hyperscalers, chip manufacturers and AI infrastructure providers
- Prepare steps for production of its optical technology to meet industry demand for 800G and 1.6T interconnects.
“BDC’s Deep Tech Venture Fund is committed to supporting visionary companies that are reshaping industries through cutting-edge technology. Hyperlume’s optical interconnect technology represents a transformative leap forward in energy-efficient AI and semiconductor infrastructure. We are proud to be part of their journey as they redefine the future of computing,” said Charles Lespérance, Partner at BDC Capital’s Deep Tech Venture Fund. Murray McCaig, Managing Partner at ArcTern Ventures added, “The carbon emissions from data centers are projected to more than double by 2030, underscoring the urgent need to invest in technologies that reduce energy consumption. Hyperlume’s groundbreaking ultra-low-power microLED interconnect technology not only significantly reduces energy usage in networking but also delivers exceptional high-bandwidth performance.”
“As the demand for AI grows, so do its energy requirements, placing a significant burden on traditional copper interconnects,” said Srini Ananth, Managing Director at Intel Capital. “Hyperlume’s technology effectively tackles the bottlenecks hindering optimal performance in AI and data centers, representing a significant step forward for the semiconductor industry as it supports the demands of an AI-driven future.”
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