New Industrial-Embedded 3D TLC SSD Solutions tailored for new designs in extreme environments requiring high throughput and low power NVMe interface.
Virtium, a leading provider of industrial solid-state drive (SSD) and memory solutions, introduced the second generation StorFl Series 3 M.2 NVMe SSD platform. The new drives are the industry’s first PCIe Gen4 solutions supporting industrial temperatures of -40°C to 85°C as well as ruggedization options for extreme environments. These new SSDs offer lower power and cost by using DRAM-less designs with industry standard M.2 2280 (22x80mm) and 2242 (22x42mm) formats that are suitable for industrial (temperature, shock and vibration) applications. They complement Virtium’s recently announced Series 3 CFexpress removable SSDs.
“The new StorFly Series 3 M.2 NVMe SSDs utilize the latest process technology and industrial-grade 3D TLC NAND flash combined with advanced power and thermal management,” said Scott Phillips, Vice President of Marketing at Virtium. “This mitigates throttling and sets an industry-first benchmark for highest throughput-per-watt and best steady-state performance compared to other industrial-grade SSDs over wide temperature ranges.”
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The new M.2 NVMe products also support five-year-plus product availability with all of the quality, reliability and consistency that Virtium has become known for in its nearly 25-year history.
StorFly Series 3 M.2 NVMe SSDs are ideally suited to industrial applications prone to temperature extremes that require a low power/heat solution that still delivers adequate capacity and performance for many industrial PC and control unit applications, including robotics, transportation, and monitoring – as well as telecommunications and networking applications focused on the 5G and optical networking explosion.
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Key features include:
- Capacity range up to 2TB
- Full industrial temperature (-40ºC to 85ºC), shock and vibration support
- Flexible formats from single-sided, higher capacity/performance M.2 2280 to smaller, lower capacity/power M.2 2242 for highly space-constrained designs
- Integrated power and thermal management for best steady-state performance over widest temperature range
- Leveraging latest silicon technology to offer low power and highest throughput-per-watt in the industry
- Integrated vtGuard power-fail protection to protect data after unexpected power loss
- Integrated vtSecure data security supporting AES encryption with crypto-erase sanitization and device locking
- Extended terabytes written endurance for extended service life in the most demanding environments and applications
- Host Memory Buffer (HMB) support to allow DRAM-less SSD to access host DRAM via the NVMe interface for improved performance
- The SSD platform will support four generations of 3D TLC, meaning the platform life cycle will be at least 10 years
- Provide locked bill-of-materials and advanced product change notification for five years
- Ruggedization options including conformal coating, BGA underfill, and thick-gold-on-connector
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