Ranovus’ Odin™ Analog-Drive CPO 2.0 eliminates the need for the retimer, resulting in 75% smaller footprint and 40% cost and power consumption savings in the Optical Interconnect.
Xilinx Versal ACAP co-packaged with Ranovus’ Odin™ Analog-Drive CPO 2.0
Ranovus Inc. announced a demonstration of Co-Packaged Optics using a Xilinx Versal ACAP and Ranovus Odin™ 800Gbps CPO 2.0. The joint demonstration between Ranovus and AMD (NASDAQ: AMD) as part of OFC 2022, the leading optical networking event in North America, highlights the arrival of the CPO 2.0 solution for AI/ML platforms that demand power efficient, high throughput and high density optical interconnect.
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RANOVUS’ Odin™ is a low latency, high density, and protocol agnostic optical engine that delivers massive optical interconnect bandwidth with industry-leading cost and power efficiency. Odin scales from 800Gbps to 3.2Tbps in the same footprint by leveraging Ranovus’ 100Gbps per lambda monolithic Electro-Photonic Integrated Circuit (EPIC) IP, laser platform, and advanced packaging technologies.
“We announced our Odin™ Analog Drive CPO 2.0 platform at OFC 2021 for Ethernet switch and module applications and are thrilled to showcase our platform with a Versal ACAP for ML/AI workloads,” said Hamid Arabzadeh, Chairman and Chief Executive Officer of RANOVUS. “We have been at the forefront of the CPO movement since 2018 and are delighted to share our multi disciplinary IP cores with our customers who want to accelerate the adoption of Analog Drive CPO in data centers.”
CPO is an innovative approach that provides Nx100Gbps PAM4 Optical I/O channels for Ethernet switch and ML/AI silicon in a single packaged assembly, which significantly reduces the cost and power consumption of the complete system.
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Versal is the industry’s first adaptive compute acceleration platform (ACAP). Versal ACAPs deliver unparalleled application- and system-level value for cloud, network, and edge applications. By integrating the optics into the package using Versal Premium ACAPs, AMD and Ranovus are able to drastically reduce power, simplify board routing, and reduce cost.
“We’re proud of our collaboration with Ranovus that helped achieve record performance levels while at the same time reducing power and overall footprint of the complete solution,” said Dan Mansur, vice president, Adaptable and Embedded Computing Group, AMD (formerly Xilinx). “This CPO demonstration highlights the versatility of the Versal GTM SERDES to operate over anything from long-reach copper to directly driving the Ranovus Analog-Drive CPO 2.0 optical engine. Co-packaging Ranovus Odin™ with Xilinx Versal is a significant advancement which enables data center customers to build highly efficient and cost-effective systems for next-generation workloads.”
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