Movandi Demonstrates High-performance Phased Array Antenna Module (PAAM) Using TSMC CMOS Technology
Movandi, a leader in 5G mmWave RF technologies and products, announces that its 300+ antenna PAAM design using TSMC CMOS technology delivers breakthrough performance with the scale and cost-efficiency of bulk CMOS. Movandi’s phased array solution delivers the ideal combination of output power, cost, antenna count and energy efficiency for mmWave infrastructure applications.
“Movandi has demonstrated its chip design excellence by delivering the highest performing PAAM for mmWave infrastructure.”
The PAAM utilizes Movandi’s expertise in antenna and RF design and incorporates Movandi’s production-shipping beamformer, up/down converter and synthesizer chips. Deep application RAMs on all Movandi chipsets allow programmable schedules and a large beam-book, for dynamic control and fast beam steering. A symbol-level PAAM controller enables accurate TDD, AGC, beamforming as well as power saving modes that include symbol-level power save and tapering.
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The Movandi PAAM was developed to support a custom ORAN-RU product and is capable of >59dBm EIRP per beam and is configurable in several modes of operation including 2T2R, 4T4R and 8T8R. The PAAM achieves this EIRP while maintaining better than 4% EVM.
“Movandi has demonstrated its chip design excellence by delivering the highest performing PAAM for mmWave infrastructure,” said Maryam Rofougaran, CEO and co-founder of Movandi. “TSMC’s industry-leading CMOS technology allows us to fulfill our customers’ requirements at scale and the most efficient price point. Our mmWave and CMOS core technology leadership is unmatched in the industry and this leap forward is just what is required in mmWave infrastructure applications.”
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CMOS technology provides industry-leading cost, EIRP and DC efficiency when compared to other options. This provides an attractive solution that blends a low-price point, moderate output power per port, optimal antenna count and excellent thermal density into an overall solution for end-product design.
Movandi’s PAAM design was developed and manufactured with the bulk CMOS technology of TSMC, the world’s leading semiconductor foundry. “TSMC has long partnered with industry innovators to extend CMOS applications from automotive to IoT and wireless,” said Sajiv Dalal, Senior Vice President of Business Management, TSMC North America. “We look forward to our continued collaboration with Movandi to help them achieve power and performance goals and accelerate their next-generation silicon innovations using our industry-leading CMOS technology.”
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