OMNIVISION debuts industry’s first three-layer stacked BSI global shutter image sensor with the smallest form factor, highest image quality, and ultra-low power consumption for eye and face tracking
OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, announced the industry’s first and only three-layer stacked BSI global shutter (GS) image sensor. The OG0TB is the world’s smallest image sensor for eye and face tracking in AR/VR/MR and Metaverse consumer devices, with a package size of just 1.64mm x 1.64mm, it has a 2.2µm pixel in a 1/14.46-inch optical format (OF). The CMOS image sensor features 400×400 resolution and ultra-low power consumption, ideal for some of the smallest and lightest battery-powered wearables, such as eye goggles and glasses.
“OMNIVISION is leading the industry by developing the world’s first three-layer stacked global shutter pixel technology and implementing it in the smallest GS image sensor with uncompromising performance”
“OMNIVISION is leading the industry by developing the world’s first three-layer stacked global shutter pixel technology and implementing it in the smallest GS image sensor with uncompromising performance,” said David Shin, staff product marketing manager – IoT/Emerging at OMNIVISION. “We pack all of these features and functions into the world’s smallest ‘ready-to-go’ image sensor, which provides design flexibility to put the camera in the most ideal placement on some of the smallest and slimmest wearable devices.” Shin adds, “Ultra-low power consumption is critical for these battery-powered devices, which can have 10 or more cameras per system. Our OG0TB BSI GS image sensor consumes less than 7.2mW at 30 frames per second (fps).”
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The worldwide market for AR/VR headsets grew 92.1% year over year in 2021, with shipments reaching 11.2 million units, according to new data from the International Data Corporation (IDC) Worldwide Quarterly AR/VR Headset Tracker1. New entrants as well as broader adoption from the commercial sector will propel the market further as headset shipments are forecast to grow 46.9% year over year in 2022. In fact, IDC expects this market to experience double-digit growth through 2026 as global shipments of AR/VR headsets surpass 50 million units by the end of the forecast, with a 35.1% compounded annual growth rate (CAGR).
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OMNIVISION is supporting the growing market for AR/VR headsets by introducing new products such as the OG0TB GS image sensor, which features the company’s most advanced technology:
- It is built on OMNIVISION’s PureCel®Plus-S stacked-die technology.
- It features a three-layer stacked sensor with pixel size at 2.2µm in a 1/14.46-inch OF to achieve 400×400 resolution.
- Nyxel® technology enables the best quantum efficiency (QE) at the 940nm NIR wavelength for sharp, accurate images of moving objects.
- The sensor’s high modulation transfer function (MTF) enables sharper images with greater contrast and more detail, which is especially important for enhancing decision-making processes in machine vision applications.
- The sensor supports a flexible interface, including MIPI with multi-drop, CPHY, SPI, etc.
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