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Efinix Selects Winbond HyperRAM for its Ti60 F100 Platform to Drive a New Generation of Compact, Ultra-Low Power AI and IoT Devices

Efinix Selects Winbond HyperRAM for its Ti60 F100 Platform to Drive a New Generation of Compact, Ultra-Low Power AI and IoT Devices
– Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge
– Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM 2.0e KGD enables designers to significantly reduce footprint and simplify design
– Featuring ultra-low power, Winbond’s HyperRAM meets or exceeds competing DRAM options in active mode and offers a standby as 140uW and hybrid sleep mode that consumes just 70uW.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced that Efinix, an innovator in programmable product platforms and technology, has selected Winbond’s HyperRAM™ memory to power a new generation of camera and sensor systems such as AI, IoT, thermal cameras, industrial cameras, robotics, and smart devices. Delivering ultra-low power in a high-performance and small form factor design, the Winbond 256Mb x16 HyperRAM 2.0e KGD provides the Efinix Titanium Ti60 F100 FPGA with a complete memory system that is easy to implement for bringing products to market quickly and cost-effectively.

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“Device manufacturers are adding sensors and connectivity to virtually all next-generation applications, driving the need for increased processing power at the edge while keeping the devices small and compact,” said Winbond. “HyperRAM is optimized for these applications by delivering ultra-low power through a hybrid sleep mode, design simplicity due to less active pins, and a tiny die size. Brand customers or system makers can easily design Ti60 (SiP 256Mbx16 HyperRAM KGD) with smaller PCB size to fit into compact application devices like wearable camera.”

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